DHL Supply Chain, a Westerville, Ohio-based division of Deutsche Post DHL Group, released “Rethinking Packaging,” a new trend report that offers a comprehensive look at the future of packaging in the logistics industry.

Harpak-ULMA, Taunton, Mass., introduced its latest smart, connected packaging solution—the Trave line—built by G. Mondini S.p.A., Italy.

Stora Enso, Sweden, entered a global partnership with Atos, France, to bring new automated retail solutions and services to market.

The global smart labels market is projected to record a CAGR of ~13% during the forecast period 2019-2029, according to a study released by Future Market Insights, Valley Cottage, N.Y.

GlobalData, UK, highlights the top clean packaging trends impacting the production, marketing and sales of consumer packaged goods in Asia-Pacific (APAC) in 2019.

Ohio State University’s Center for Design and Manufacturing Excellence (CDME), Columbus, Ohio, opened the new Artificially Intelligent Manufacturing Systems Lab (AIMS) to tap into the power of artificial intelligence (AI) to transform the future of manufacturing.

TPG Rewards, Aventura, Fla., launched what is said to be the largest on-pack intelligent packaging program for Kraft Heinz, Pittsburgh, Pa.

Tovala Chicago, introduced Scan The Store, which uses Tovala’s smart technology Tovala IQ to allow consumers to cook frozen foods just by scanning their barcodes.

A bite of bad yogurt or sip of spoiled milk could be a thing of the past thanks to a new sensor developed by Silvana Andreescu, professor of chemistry and biomolecular science at Clarkson University, N.Y., and Egon Matijevic Chair of Chemistry.